Siemens unveils PAVE360 Automotive, a new digital twin technology aimed at accelerating next-generation SDV development.

Phoenix Contact has launched its new M17 PRO hybrid connector, developed in line with the IEC 61076-2-117 standard.

Despite these gains, Micron acknowledged ongoing supply constraints. Mehrotra noted that the company can currently meet only ...

ROHM has announced the launch of two new motor driver integrated circuits (ICs) designed for brushed DC motors: the BD60210FV ...

The technology platform, previously known as Rapidus AI-Assisted Design Solution (Raads), will be rebranded as Rapidus ...

Voyant Photonics has introduced the Helium Platform, the industry’s first fully solid-state frequency-modulated ...

Global memory prices are forecast to rise sharply in the first quarter of 2026, extending a trend that has already placed ...

ByteSnap Design outlines predictions for 2026 and how it will mark a decisive transition for embedded and electronics.

New Electronics talks with Rudy Sengupta - VP and GM, NI Test and Analytics Software, Test and Measurement, Emerson – about ...

NewTek has announced broader deployment of its Linear Variable Differential Transformers (LVDTs) in pipeline monitoring.

Intl completes second-generation High Numerical Aperture (High-NA) extreme ultraviolet (EUV) lithography system testing.

To enhance analogue and mixed-signal verification, Toshiba has adopted Siemens’ Solido Simulation Suite and Solido Design ...