Abstract: In this study, two problems of flip chip on glass-core package substrate will be investigated. The first problem deals with the flip chip on glass-core package substrate with microbumps and ...
This is the second article in a six-part series highlighting the sourcing, engineering, commercial availability, and use of ...
Abstract: This work presents an acoustic platform using solidly mounted thin-oriented lithium niobate (LiNbO3) film on silicon (Si). A thin layer of amorphous Si eliminates a conductive layer ...
Think of substrate as the base layer—the common ground where we can all work together to understand problems and drive solutions forward. Instead of fragmented discussions and reinventing the wheel, ...
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