Abstract: In this study, three solders, Sn-37Pb, Sn-3.5Ag, and Sn3.8-Ag-0.7Cu, were screen printed on both electroless Ni/Au and OSP finished micro-via PCBs. The pad opening size and pitch of ...
Abstract: Semiconductor packaging continues to migrate from wire bond to flip chip first level interconnect to meet aggressive size, weight and electrical performance requirements. In addition, novel ...
Shrew is family of ESCs (Electronic Speed Controller) that can drive two brushed motors, with an ELRS receiver integrated. It is designed to be as small as possible yet still pack plenty of power. It ...
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